RGT Technology, LLC . . .

PRODUCTS-5
Image of WAKEFIELD 511-12M

Details

Part Number 511-12M
Manufacturer WAKEFIELD
Category PRODUCTS-5
Price Request Quote
Lead Time Request Quote

Description

High Fin Density Heat Sink for Power Modules, IGBTS, Relays; Overall Dimensions (W x L x H) in inches:5.210 x 12.000 x 2.350 Simple Type: Heat Sinks

Request a Quote

* indicates a required field.
Your Contact Information
Your Company/Organization
Your Requirement
By sending us your information, you are affirming your agreement with our Privacy Policy.
You will not receive unsolicited communications.

Related Products

WAKEFIELD
Wakefield 2016 72" Extrusion Simple Type: Passives
WAKEFIELD
Fasteners, Clamp Simple Type: Tools & Production Supplies
WAKEFIELD
Deltem(TM) Pin Fin Heat Sink for ASICs, Intel i960KA(TM), Intel 486DX2. Base Dimension in inches:0.850 x 0.40; Color:Dark Gray Simple Type: Heat Sinks
WAKEFIELD
Deltem(TM) Pin Fin Heat Sink for Intel i960KA(TM), Cyrix Cx486SLC, ASICs with ARolad 8223 Thermally Conductive Bonding Tape. Dimensions in inches:0.850 square x 0.40 H; Color:Black with Aluminum Flakes Simple Type: Heat Sinks
WAKEFIELD
Deltem(TM) Pin Fin Heat Sink for Intel i960KA(TM), Cyrix Cx486SLC, ASICs. Dimensions in inches:0.850 square x 0.40 H; Color:Black with Aluminum Flakes Simple Type: Heat Sinks

Specifications

Not available

Datasheet

Not available

Do you need an 511-12M? We can help you find it at a competitive price!