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Part Number Manufacturer Description Brand Price & Lead Time
2016 WAKEFIELD Wakefield 2016 72" Extrusion Simple Type: Passives Request Quote
205SB WAKEFIELD 205 Series Board Level Heat Sink Simple Type: Passives Request Quote
206-1PABH WAKEFIELD HEATSINK VERT ALUM BLK TO-220 Simple Type: Thermal Management Request Quote
207AB WAKEFIELD High-Efficiency Heat Sink for Small Metal Can Power Semiconductors-Aluminum, Black Anodized. Type:Dual-Level Star; Heat Sink IDxODxH in inches:0.255 x 0.72 x 0.375; Applicable Case Types:TO-5, VTO-9, TO-11, TO-12, TO-26, TO-29, TO-33, TO-43, TO-45. Simple Type: Passives Request Quote
207SB WAKEFIELD High-Efficiency Heat Sink for Small Metal Can Power Semiconductors-Silver-Bearing Copper; Black Ebonol "C". Type:Dual-Level Star; Heat Sink IDxODxH in inches:0.255x0.72x0.375; Applicable Case Types:TO-5,VTO-9,TO-11,TO-12,TO-26,TO-29,TO-33,TO-43,TO-45. Simple Type: Heat Sinks Request Quote
217-36CT6 WAKEFIELD HEATSINK DPAK SMT TIN PLATED Simple Type: Semiconductors Request Quote
217-36CTE6 WAKEFIELD HEATSINK DPAK SMT TIN PLATED Simple Type: Thermal Management Request Quote
218-40CT3 WAKEFIELD HEATSINK ALUM BLACK SMD Simple Type: Thermal Management Request Quote
218-40CT5 WAKEFIELD HEATSINK ALUM NATURAL SMD Simple Type: Thermal Management Request Quote
230-75AB WAKEFIELD HEATSINK TO-220 VERT/HORZ BLK Simple Type: Semiconductors Request Quote
231-69PAB-15V WAKEFIELD HEATSINK Simple Type: Thermal Management Request Quote
233-60AB WAKEFIELD HEATSINK TO-220 VERT/HORZ BLK Simple Type: Thermal Management Request Quote
233-60AB-10 WAKEFIELD 233 Series Board Level Heat Sink Simple Type: Passives Request Quote
235-85AB WAKEFIELD HEATSINK TO-220 CLIP-ON BLK Simple Type: Thermal Management Request Quote
236-150AB-05 WAKEFIELD Heat Sink Simple Type: Semiconductors Request Quote
240-118ABH-22 WAKEFIELD HEATSINK TO-220 VERT TWIST FIN Simple Type: Semiconductors Request Quote
243-3PAB WAKEFIELD HEATSINK TO-220 CLIP-ON BLK Simple Type: Thermal Management Request Quote
258 WAKEFIELD Board Level Power Semiconductor Heat Sink; Thermal Links for Fused Glass Diodesl Dimensions (L x W x H) in inches:0.500 x 0.250 x 0.340 Simple Type: Tools & Production Supplies Request Quote
260-4T5E WAKEFIELD Cup Clips For TO-5 Case Style Board Level Power Semiconductor Heat Sink. Insulation Type:Epoxy Insulated; Outline Dimension (L x W x I.D.) in inches:0.370 x 0.380 diameter x 0.290; Weight in pounds:0.0024 Simple Type: Passives Download the datasheet (PDF) Request Quote
260-4TH5E WAKEFIELD Cup Clips For TO-5 Case Style Board Level Power Semiconductor Heat Sink. Insulation Type:Epoxy Insulated; Outline Dimension (L x W x I.D.) in inches:0.400 x 0.370 hex x 0.290; Weight in pounds:0.0031 Simple Type: ELECTROMECHANICAL & INDUSTRIAL CONTROL Request Quote
260-6SH5E WAKEFIELD Cup Clips For TO-5 Case Style Board Level Power Semiconductor Heat Sink. Insulation Type:Epoxy Insulated; Outline Dimension (L x W x I.D.) in inches:0.557 x 0.370 hex x 0.290; Weight in pounds:0.0037 Simple Type: Passives Request Quote
262-75AB-01 WAKEFIELD HEATSINK VERT/HORIZ BLACK TO-220 Simple Type: Thermal Management Request Quote
262-75AB-05 WAKEFIELD HEATSINK VERT/HORIZ BLACK TO-220 Simple Type: Thermal Management Request Quote
265-118ABH-22 WAKEFIELD HEATSINK VERT ALUM BLACK TO-220 Simple Type: Thermal Management Request Quote
270-AB WAKEFIELD Small Footprint Low-Cost Heat Sink-TO-220, TO-202 Case Styles; Height Above PC Board in inches:0.375. Horizontal Mounting Max. Footprint in inches:1.750 x 0.700; Natural Convection/Forced Convection:70 degree C at 4W/6.0 degrees; Weight in pounds:0.0052 Simple Type: Semiconductors Request Quote