RGT Technology, LLC . . .
| Part Number | Manufacturer | Description | Brand | Price & Lead Time |
|---|---|---|---|---|
| 217-36CT6 | WAKEFIELD | HEATSINK DPAK SMT TIN PLATED Simple Type: Semiconductors | Request Quote | |
| 217-36CTE6 | WAKEFIELD | HEATSINK DPAK SMT TIN PLATED Simple Type: Thermal Management | Request Quote | |
| 218-40CT3 | WAKEFIELD | HEATSINK ALUM BLACK SMD Simple Type: Thermal Management | Request Quote | |
| 218-40CT5 | WAKEFIELD | HEATSINK ALUM NATURAL SMD Simple Type: Thermal Management | Request Quote | |
| 230-75AB | WAKEFIELD | HEATSINK TO-220 VERT/HORZ BLK Simple Type: Semiconductors | Request Quote | |
| 231-69PAB-15V | WAKEFIELD | HEATSINK Simple Type: Thermal Management | Request Quote | |
| 233-60AB | WAKEFIELD | HEATSINK TO-220 VERT/HORZ BLK Simple Type: Thermal Management | Request Quote | |
| 233-60AB-10 | WAKEFIELD | 233 Series Board Level Heat Sink Simple Type: Passives | Request Quote | |
| 235-85AB | WAKEFIELD | HEATSINK TO-220 CLIP-ON BLK Simple Type: Thermal Management | Request Quote | |
| 236-150AB-05 | WAKEFIELD | Heat Sink Simple Type: Semiconductors | Request Quote | |
| 240-118ABH-22 | WAKEFIELD | HEATSINK TO-220 VERT TWIST FIN Simple Type: Semiconductors | Request Quote | |
| 243-3PAB | WAKEFIELD | HEATSINK TO-220 CLIP-ON BLK Simple Type: Thermal Management | Request Quote | |
| 258 | WAKEFIELD | Board Level Power Semiconductor Heat Sink; Thermal Links for Fused Glass Diodesl Dimensions (L x W x H) in inches:0.500 x 0.250 x 0.340 Simple Type: Tools & Production Supplies | Request Quote | |
| 260-4T5E | WAKEFIELD | Cup Clips For TO-5 Case Style Board Level Power Semiconductor Heat Sink. Insulation Type:Epoxy Insulated; Outline Dimension (L x W x I.D.) in inches:0.370 x 0.380 diameter x 0.290; Weight in pounds:0.0024 Simple Type: Passives Download the datasheet (PDF) | Request Quote | |
| 260-4TH5E | WAKEFIELD | Cup Clips For TO-5 Case Style Board Level Power Semiconductor Heat Sink. Insulation Type:Epoxy Insulated; Outline Dimension (L x W x I.D.) in inches:0.400 x 0.370 hex x 0.290; Weight in pounds:0.0031 Simple Type: ELECTROMECHANICAL & INDUSTRIAL CONTROL | Request Quote | |
| 260-6SH5E | WAKEFIELD | Cup Clips For TO-5 Case Style Board Level Power Semiconductor Heat Sink. Insulation Type:Epoxy Insulated; Outline Dimension (L x W x I.D.) in inches:0.557 x 0.370 hex x 0.290; Weight in pounds:0.0037 Simple Type: Passives | Request Quote | |
| 262-75AB-01 | WAKEFIELD | HEATSINK VERT/HORIZ BLACK TO-220 Simple Type: Thermal Management | Request Quote | |
| 262-75AB-05 | WAKEFIELD | HEATSINK VERT/HORIZ BLACK TO-220 Simple Type: Thermal Management | Request Quote | |
| 265-118ABH-22 | WAKEFIELD | HEATSINK VERT ALUM BLACK TO-220 Simple Type: Thermal Management | Request Quote | |
| 270-AB | WAKEFIELD | Small Footprint Low-Cost Heat Sink-TO-220, TO-202 Case Styles; Height Above PC Board in inches:0.375. Horizontal Mounting Max. Footprint in inches:1.750 x 0.700; Natural Convection/Forced Convection:70 degree C at 4W/6.0 degrees; Weight in pounds:0.0052 Simple Type: Semiconductors | Request Quote | |
| 301M | WAKEFIELD | 301 Series Extruded Heat Sink, 2.5 /W at 250 ft/min Forced Convection, 70 at 15 W Thermal Resistan Simple Type: Passives | Request Quote | |
| 301N | WAKEFIELD | Heat Sink Simple Type: Semiconductors | Request Quote | |
| 302M | WAKEFIELD | 302 Series Extruded Heat Sink, 1.8 /W at 250 ft/min Forced Convection, 50 at 15 W Thermal Resistan Simple Type: Passives | Request Quote | |
| 302N | WAKEFIELD | Heat Sink Simple Type: Semiconductors | Request Quote | |
| 302NN | WAKEFIELD | Compact Heat Sink for Dual Stud-Mounted Semiconductor Case. Outline Dimensions in inches:2.000 x 2.000; Length in inches:1.5; Mounting Holes:(2) 1/4-28 UNF Simple Type: Semiconductors | Request Quote | |
| 303N | WAKEFIELD | Compact Heat Sink for Dual Stud-Mounted Semiconductor Case. Outline Dimensions in inches:2.000 x 2.000; Length in inches:3; Mounting Holes:(1) 1/4-28 UNF Simple Type: Semiconductors | Request Quote | |
| 303NN | WAKEFIELD | 303 Series Extruded Heat Sink, 1.3 /W at 250 ft/min Forced Convection, 37 at 15 W Thermal Resistan Simple Type: Passives | Request Quote | |
| 330SC | WAKEFIELD | FASTENERS, CLIP RoHS Compliant: Yes Simple Type: ELECTROMECHANICAL & INDUSTRIAL CONTROL | Request Quote | |
| 330-SC | WAKEFIELD | SPEEDCLIP S/S FOR 667 SERIES Simple Type: Thermal Management | Request Quote | |
| 392-120AB | WAKEFIELD | Heat Sink Simple Type: Semiconductors | Request Quote |